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DAC 2026 · Long Beach Convention Center · Jul 26–29

Come talk silicon with us at DAC 2026.

We're bringing the full EDA 3.0 stack to Long Beach — twelve partners across architecture, verification, yield and orchestration. Catch Simon's EDA 3.0 overview, book a 1:1 briefing, or grab time with the partner that fits your roadmap.

Not in Long Beach? We're booking remote slots before and after the show — grab a video briefing →

Why spend 30 minutes with us

One stack, the whole lifecycle.

Most EDA tools make a single step faster. EDA 3.0 connects them — intent, architecture, RTL, verification, yield and orchestration as one AI-native lifecycle. We curate the partners that make that real, and at DAC you can see the whole stack in one place.

What is EDA 3.0? →

$1T
semiconductor industry by 2030 —
the opportunity EDA 3.0 is built for.

Reserved sessions · limited seats

The EDA 3.0 Overview, live with Simon Bennett

A 30-minute walk through the six-layer, AI-native semiconductor lifecycle — from intent to yield — and where the orchestration layer is still wide open. Held at reserved times across the show; seats are capped so the room stays a conversation, not a keynote.

SB Simon Bennett
Principal Solutions Consultant & Co-Founder
Reserved seating — book ahead
Reserve a seat

Book a session

Pick your way in.

Tell us what's slowing your roadmap and we'll bring the right partners to the table. Open any one to see who solves it — then sign up for a session.

L1 From intent to silicon Are your requirements drifting from your design?

Requirements live in one tool, the design in another, and traceability breaks the moment something changes — which is fatal when functional safety and audits are on the line. We connect requirements to the design record so intent survives all the way to tape-out.

Jama SoftwareGlide
L2 Architecture & pre-silicon Still waiting on silicon before your software can start?

Hand-tuned RTL and late software bring-up are where schedules go to die. AI-driven high-level synthesis and high-performance virtual prototypes let you explore architecture and boot real software before the chip exists.

Rise Design AutomationMachineWare
L3 Design, IP & edge Is chiplet, IP, or edge-AI integration slowing your roadmap?

Chiplet and UCIe integration, embedded firmware, and edge-AI deployment each carry their own risk. We bring proven IP and software teams that have shipped it, so integration stops being the long pole on your schedule.

InPsyCraftifAIModelCat
L4 Verification Is verification the bottleneck on your critical path?

Simulation samples; it can't prove a bug isn't there. Formal verification at enterprise scale gives you exhaustive proof on the blocks that matter — and the same rigor extends to RF and microwave design and test.

AxiomiseQuaxys
L5–6 Yield & orchestration Losing margin to yield surprises, or drowning in disconnected tools?

Yield data sits in the fab, design sits upstream, and nobody connects them. We close that loop with yield analytics, enterprise AI, and the compute to run it — turning the lifecycle into something you can actually orchestrate.

YieldWerxSoftwebTuple

Twelve partners, one lifecycle — ordered intent (L1) to orchestration (L6). Open any one for the short version, then book a session or visit their site.

L1 Jama Software — live requirements traceability Requirements & traceability

The de facto requirements-management solution across the global semiconductor industry. Jama Connect keeps requirements, tests and design linked in real time — built for functional safety and audit.

Jama ConnectFuSaISO 26262TÜV SÜD qualified
L1 Glide — lifecycle data management Engineering data, end to end

A single, traceable source of truth for engineering data across the whole program lifecycle, so nothing gets lost between teams and tools.

Lifecycle dataTraceability
L2 Rise Design Automation — AI-enabled HLS Architecture & synthesis

High-level synthesis that compresses the path from algorithm to optimized RTL, so architecture exploration takes days instead of months.

HLSArchitectureRTL
L2 MachineWare — high-performance virtual prototyping Pre-silicon software bring-up

Virtual platforms fast enough to boot and debug real software long before silicon arrives — so software stops waiting on hardware.

Virtual prototypingPre-silicon
L3 InPsy — IP for high-performance chiplets IP & chiplets

IP engineered for chiplet and UCIe-class systems, where integration risk is highest and getting the interconnect right is everything.

ChipletsUCIeIP
L3 CraftifAI — embedded, IoT & edge-AI software Firmware & edge deployment

Firmware and edge-AI deployment across MCU, IoT and FPGA targets — the software muscle to actually ship what you've designed.

EmbeddedEdge AIFirmware
L3 ModelCat — automated AI model development AI model dev & optimization

Automated development and optimization of AI models for your silicon targets — getting models from prototype to production-ready faster.

AI modelsOptimization
L4 Axiomise — formal verification at enterprise scale Exhaustive proof, not sampling

Exhaustive, mathematical proof on the blocks that matter — not sampled simulation. Find the bugs simulation will never reach, sooner.

FormalVerificationProof
L4 Quaxys — RF & microwave design + cloud test RF & test

End-to-end RF and microwave design with a cloud-based test platform — closing the slow, fragmented loop between design and measurement.

RFMicrowaveTest
L5 YieldWerx — yield analytics & manufacturing intelligence Yield & manufacturing

Turns test and yield data into action, connecting the fab back to design so margin surprises become signals you can act on.

YieldAnalyticsManufacturing
L6 Softweb Solutions — enterprise AI, cloud & transformation Enterprise AI & orchestration

Enterprise AI and cloud — agent orchestration, intelligence layers, IoT and vision — to scale the whole lifecycle across the organization.

Enterprise AICloudOrchestration
L6 Tuple Technologies — build, run & scale compute Compute & scale

The compute and AI-workload backbone behind the rest of the stack — build, run and scale your engineering and AI workloads without the infrastructure headache.

ComputeScaleAI workloads

Who you'll be meeting

Three people, no slideware ambush.

SB

Simon Bennett

Principal Solutions Consultant & Co-Founder

Former Synopsys CAE & operations director and Intel IP/EDA veteran. Architect of the EDA 3.0 thesis and co-author of The Connector's Playbook. Simon gives the EDA 3.0 overview.

JS

John Simmons

Principal Sales Consultant & Co-Founder

EDA and IP veteran and co-author of the three-book series. The connector who knows the industry and opens the right doors to the right people.

BM

Brandon Meredith

Solutions Consultant

Runs partner solutions and live POCs on the floor — the person to grab for a hands-on look at any partner in the stack.

Something else on your mind?

Tell us what you'd like to cover.

Not sure which session fits, or after something that isn't on the menu? Give us the gist and we'll line up the right people for your 1:1 at DAC — or a remote slot if you're not in Long Beach.

or email us directly →

Where to find us

Three ways to get time with us.

On the show floor
AITS base camp
Long Beach Convention Center · daytime sessions throughout DAC, Jul 26–29.
Before & after hours
Long Beach Marriott
Morning and evening slots for a quieter, longer conversation off the floor.
Not at DAC?
Remote briefing
We're booking video slots before and after the show — reserve one →